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Cost-driven design of smart microsystems

紀錄類型:	書目-語言資料,印刷品 : 單行本
作者:	NiedermayerMichael, 1971-
出版地:	Boston
出版者:	Artech House;
出版年:	2012
面頁冊數:	xii, 229 p.ill. : 24 cm.;
集叢名:	Artech House integrated microsystems series
標題:	Microelectromechanical systems -
附註:	Includes bibliographical references and index
ISBN:	9781608070848
內容註:	Machine generated contents note: 1. Introduction -- References -- 2. Design Methodologies -- 2.1. Design Strategies -- 2.2. Design of Embedded Systems -- 2.2.1. Design Strategies for Digital Circuits -- 2.2.2. Design Strategies for Analog Circuits -- 2.3. Design of Electronic Components and Microsystems -- 2.4. Design of Modules with Heterogeneous Components -- 2.5. Design of Communication Protocols -- 2.6. Design Models for Smart Microsystems -- References -- 3. Fabrication Processes -- 3.1. Semiconductor Technologies -- 3.1.1. Wafer Fabrication -- 3.1.2. Wafer Test -- 3.1.3. Chip Packaging and Class Test -- 3.2. Module Integration Technologies -- 3.2.1. Fabrication of Module Substrates -- 3.2.2. Assembly and Interconnection -- 3.2.3. Passivation and Encapsulation Technologies -- 3.3. Process Modeling -- References -- 4. Physical Design Decisions -- 4.1. Basic Elements of Module Integration -- 4.1.1. Wiring Capacity of Substrates -- 4.1.2. Module Systems -- 4.2. Placement and Routing -- 4.2.1.Component Arrangement -- 4.2.2.Component Wiring -- 4.2.3. Ensuring the Signal Integrity -- 4.3. Determination of the Miniaturization Potential -- 4.3.1. Volume Aggregation Lists -- 4.3.2. Simplified Geometry Models -- 4.3.3. Adapted Geometry Models -- References -- 5. Structural Design Trade-Offs -- 5.1. Data Processing -- 5.1.1.Computing Architectures -- 5.1.2. Implementation of System Functions -- 5.2. Ambient Interface -- 5.2.1. Sensor and Actuators -- 5.2.2. Processing of Sensor Data -- 5.3. Power Supply -- 5.3.1. Power Consumption of the Functional Components -- 5.3.2. Energy Storage and Power Conversion -- 5.4.Communication Interface -- 5.4.1. Radio Architectures -- 5.4.2. Layout of Transmitter and Receiver Circuitry -- 5.5. Modeling and Simulation of System Architectures -- 5.5.1. Optimization of Analog Architectural Elements -- 5.5.2. Optimization of Digital Architectural Elements -- References -- 6. Leverage Effects of the Functional Design -- 6.1. Properties of the Surrounding Medium -- 6.1.1. Concentrated and Distributed Phenomena -- 6.1.2. Signal Propagation -- 6.1.3. Interferences -- 6.1.4. Modeling of Environmental Influences -- 6.2. Radio Communications -- 6.2.1. Modulation Schemes -- 6.2.2. Media Access Schemes -- 6.2.3. Logical Link Control -- 6.2.4.Network Control -- 6.3. Distributed Data Acquisition -- 6.3.1. Localization -- 6.3.2. Synchronization and Calibration -- 6.4. Determination of Functional Optimization Potential -- 6.4.1. Aggregation Lists of System Parameters -- 6.4.2. Simplified System Models -- 6.4.3. Adapted System Models -- References -- 7. Cost Fundamentals -- 7.1. Basic Cost Categories -- 7.2. Approaches of Cost Estimation -- 7.2.1. Cost Determination of Fabrication Processes -- 7.2.2. Cost Determination of System Components -- 7.3. Direct Component Costs -- 7.3.1. Determination of Cost-Driving Function Components -- 7.3.2. Determination of Costs for Module Integration -- 7.4. Indirect Costs of Product Development -- 7.4.1. Development Effort of Hardware -- 7.4.2. Development Effort of Software -- 7.4.3. Generalized Cost Modeling of Development Activities -- 7.4.4. Influence of Expectations -- References -- 8. Cost Reduction Strategies -- 8.1. Model-Based Cost Optimization -- 8.1.1. Determination of Potential Cost Reduction -- 8.1.2. Design Flow -- 8.2. Smart Microsystems with Tailored Architectures -- 8.3. Smart Microsystems with Universal Architectures -- 8.4. Smart Microsystems with Modular Architectures -- References -- 9. Application Examples -- 9.1. Smart Microsystems for Tracking Transport Goods -- 9.1.1. Functional Design Decisions -- 9.1.2. Physical Design Decisions -- 9.2. Smart Microsystems for Condition Monitoring -- 9.2.1. Functional Design Decisions -- 9.2.2. Physical Design Decisions

Cost-driven design of smart microsystems
Niedermayer, Michael

Cost-driven design of smart microsystems / Michael Niedermayer - Boston : Artech House, 2012. - xii, 229 p. ; ill. ; 24 cm.. - (Artech House integrated microsystems series).
Machine generated contents note: 1. Introduction -- References -- 2. Design Methodologies -- 2.1. Design Strategies -- 2.2. Design of Embedded Systems -- 2.2.1. Design Strategies for Digital Circuits -- 2.2.2. Design Strategies for Analog Circuits -- 2.3. Design of Electronic Components and Microsystems -- 2.4. Design of Modules with Heterogeneous Components -- 2.5. Design of Communication Protocols -- 2.6. Design Models for Smart Microsystems -- References -- 3. Fabrication Processes -- 3.1. Semiconductor Technologies -- 3.1.1. Wafer Fabrication -- 3.1.2. Wafer Test -- 3.1.3. Chip Packaging and Class Test -- 3.2. Module Integration Technologies -- 3.2.1. Fabrication of Module Substrates -- 3.2.2. Assembly and Interconnection -- 3.2.3. Passivation and Encapsulation Technologies -- 3.3. Process Modeling -- References -- 4. Physical Design Decisions -- 4.1. Basic Elements of Module Integration -- 4.1.1. Wiring Capacity of Substrates -- 4.1.2. Module Systems -- 4.2. Placement and Routing -- 4.2.1.Component Arrangement -- 4.2.2.Component Wiring -- 4.2.3. Ensuring the Signal Integrity -- 4.3. Determination of the Miniaturization Potential -- 4.3.1. Volume Aggregation Lists -- 4.3.2. Simplified Geometry Models -- 4.3.3. Adapted Geometry Models -- References -- 5. Structural Design Trade-Offs -- 5.1. Data Processing -- 5.1.1.Computing Architectures -- 5.1.2. Implementation of System Functions -- 5.2. Ambient Interface -- 5.2.1. Sensor and Actuators -- 5.2.2. Processing of Sensor Data -- 5.3. Power Supply -- 5.3.1. Power Consumption of the Functional Components -- 5.3.2. Energy Storage and Power Conversion -- 5.4.Communication Interface -- 5.4.1. Radio Architectures -- 5.4.2. Layout of Transmitter and Receiver Circuitry -- 5.5. Modeling and Simulation of System Architectures -- 5.5.1. Optimization of Analog Architectural Elements -- 5.5.2. Optimization of Digital Architectural Elements -- References -- 6. Leverage Effects of the Functional Design -- 6.1. Properties of the Surrounding Medium -- 6.1.1. Concentrated and Distributed Phenomena -- 6.1.2. Signal Propagation -- 6.1.3. Interferences -- 6.1.4. Modeling of Environmental Influences -- 6.2. Radio Communications -- 6.2.1. Modulation Schemes -- 6.2.2. Media Access Schemes -- 6.2.3. Logical Link Control -- 6.2.4.Network Control -- 6.3. Distributed Data Acquisition -- 6.3.1. Localization -- 6.3.2. Synchronization and Calibration -- 6.4. Determination of Functional Optimization Potential -- 6.4.1. Aggregation Lists of System Parameters -- 6.4.2. Simplified System Models -- 6.4.3. Adapted System Models -- References -- 7. Cost Fundamentals -- 7.1. Basic Cost Categories -- 7.2. Approaches of Cost Estimation -- 7.2.1. Cost Determination of Fabrication Processes -- 7.2.2. Cost Determination of System Components -- 7.3. Direct Component Costs -- 7.3.1. Determination of Cost-Driving Function Components -- 7.3.2. Determination of Costs for Module Integration -- 7.4. Indirect Costs of Product Development -- 7.4.1. Development Effort of Hardware -- 7.4.2. Development Effort of Software -- 7.4.3. Generalized Cost Modeling of Development Activities -- 7.4.4. Influence of Expectations -- References -- 8. Cost Reduction Strategies -- 8.1. Model-Based Cost Optimization -- 8.1.1. Determination of Potential Cost Reduction -- 8.1.2. Design Flow -- 8.2. Smart Microsystems with Tailored Architectures -- 8.3. Smart Microsystems with Universal Architectures -- 8.4. Smart Microsystems with Modular Architectures -- References -- 9. Application Examples -- 9.1. Smart Microsystems for Tracking Transport Goods -- 9.1.1. Functional Design Decisions -- 9.1.2. Physical Design Decisions -- 9.2. Smart Microsystems for Condition Monitoring -- 9.2.1. Functional Design Decisions -- 9.2.2. Physical Design Decisions.
Includes bibliographical references and index.
ISBN 9781608070848ISBN 1608070840
Microelectromechanical systems

Cost-driven design of smart microsystems
LDR:04466cam2 2200229 4500 001 85827
005 20230119115651.0
009 ocn749873361
010 1 $a 9781608070848 $b hbk. $d GBP66
010 1 $a 1608070840 $b hbk.
100 $a 20150525d2012 k y0engy50 ba
101 0 $a eng
102 $a us $b ma
105 $a a a 001yy
200 1 $a Cost-driven design of smart microsystems $f Michael Niedermayer
210 $a Boston $d 2012 $c Artech House
215 1 $a xii, 229 p. $c ill. $d 24 cm.
225 1 2 $a Artech House integrated microsystems series
300 $a Includes bibliographical references and index
327 1 $a Machine generated contents note: 1. Introduction -- References -- 2. Design Methodologies -- 2.1. Design Strategies -- 2.2. Design of Embedded Systems -- 2.2.1. Design Strategies for Digital Circuits -- 2.2.2. Design Strategies for Analog Circuits -- 2.3. Design of Electronic Components and Microsystems -- 2.4. Design of Modules with Heterogeneous Components -- 2.5. Design of Communication Protocols -- 2.6. Design Models for Smart Microsystems -- References -- 3. Fabrication Processes -- 3.1. Semiconductor Technologies -- 3.1.1. Wafer Fabrication -- 3.1.2. Wafer Test -- 3.1.3. Chip Packaging and Class Test -- 3.2. Module Integration Technologies -- 3.2.1. Fabrication of Module Substrates -- 3.2.2. Assembly and Interconnection -- 3.2.3. Passivation and Encapsulation Technologies -- 3.3. Process Modeling -- References -- 4. Physical Design Decisions -- 4.1. Basic Elements of Module Integration -- 4.1.1. Wiring Capacity of Substrates -- 4.1.2. Module Systems -- 4.2. Placement and Routing -- 4.2.1.Component Arrangement -- 4.2.2.Component Wiring -- 4.2.3. Ensuring the Signal Integrity -- 4.3. Determination of the Miniaturization Potential -- 4.3.1. Volume Aggregation Lists -- 4.3.2. Simplified Geometry Models -- 4.3.3. Adapted Geometry Models -- References -- 5. Structural Design Trade-Offs -- 5.1. Data Processing -- 5.1.1.Computing Architectures -- 5.1.2. Implementation of System Functions -- 5.2. Ambient Interface -- 5.2.1. Sensor and Actuators -- 5.2.2. Processing of Sensor Data -- 5.3. Power Supply -- 5.3.1. Power Consumption of the Functional Components -- 5.3.2. Energy Storage and Power Conversion -- 5.4.Communication Interface -- 5.4.1. Radio Architectures -- 5.4.2. Layout of Transmitter and Receiver Circuitry -- 5.5. Modeling and Simulation of System Architectures -- 5.5.1. Optimization of Analog Architectural Elements -- 5.5.2. Optimization of Digital Architectural Elements -- References -- 6. Leverage Effects of the Functional Design -- 6.1. Properties of the Surrounding Medium -- 6.1.1. Concentrated and Distributed Phenomena -- 6.1.2. Signal Propagation -- 6.1.3. Interferences -- 6.1.4. Modeling of Environmental Influences -- 6.2. Radio Communications -- 6.2.1. Modulation Schemes -- 6.2.2. Media Access Schemes -- 6.2.3. Logical Link Control -- 6.2.4.Network Control -- 6.3. Distributed Data Acquisition -- 6.3.1. Localization -- 6.3.2. Synchronization and Calibration -- 6.4. Determination of Functional Optimization Potential -- 6.4.1. Aggregation Lists of System Parameters -- 6.4.2. Simplified System Models -- 6.4.3. Adapted System Models -- References -- 7. Cost Fundamentals -- 7.1. Basic Cost Categories -- 7.2. Approaches of Cost Estimation -- 7.2.1. Cost Determination of Fabrication Processes -- 7.2.2. Cost Determination of System Components -- 7.3. Direct Component Costs -- 7.3.1. Determination of Cost-Driving Function Components -- 7.3.2. Determination of Costs for Module Integration -- 7.4. Indirect Costs of Product Development -- 7.4.1. Development Effort of Hardware -- 7.4.2. Development Effort of Software -- 7.4.3. Generalized Cost Modeling of Development Activities -- 7.4.4. Influence of Expectations -- References -- 8. Cost Reduction Strategies -- 8.1. Model-Based Cost Optimization -- 8.1.1. Determination of Potential Cost Reduction -- 8.1.2. Design Flow -- 8.2. Smart Microsystems with Tailored Architectures -- 8.3. Smart Microsystems with Universal Architectures -- 8.4. Smart Microsystems with Modular Architectures -- References -- 9. Application Examples -- 9.1. Smart Microsystems for Tracking Transport Goods -- 9.1.1. Functional Design Decisions -- 9.1.2. Physical Design Decisions -- 9.2. Smart Microsystems for Condition Monitoring -- 9.2.1. Functional Design Decisions -- 9.2.2. Physical Design Decisions
606 $a Microelectromechanical systems $3 98488 $2 lc $3 133222
676 $a 621.381 $v 23
680 $a TK7875 $b N54 2012
700 1 $a Niedermayer $b Michael $f 1971- $3 151100
801 0 $a TW $b NTC $c 20150525 $g AACR2 $m 4